Design Features of this Model:
1. This machine is a conveyor-type precision automatic sandblaster equipped with a precision cyclone separator, a vibrating screen, and a filter dust collector. It utilizes a flexible mesh belt conveyor and a unique negative pressure suction design, making it suitable for sandblasting ultra-thin wafers. It ensures smooth sandblasting of wafers up to 10µ thick without deformation or breakage.
2. Equipped with a high-efficiency cyclone separator and vibrating screen, it can handle ultra-fine abrasives, i.e., 800-1500 mesh, ensuring it meets the requirements of ultra-fine sandblasting for silicon wafers.
3. A fully CNC human-machine interface allows for full recording of the entire machine's operating status. Process adjustments, including blasting pressure, operating speed, and negative pressure, can be made via the touchscreen control console.
Applications:
Sandblasting of various silicon wafers and ultra-thin silicon wafers. Automatic sandblasting of various ultra-thin and fragile items.